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PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
Rev. 01 -- 29 June 2009 Product data sheet
1. General description
The PCA9527 is a 3-channel bidirectional open-drain bus buffer for Display Data Control (DDC) clock, data and Consumer Electronic Control (CEC) for HDMI application. The device has two power supply pins to allow voltage level shift from 2.7 V to 5 V, and a rise time accelerator on port A of each DDC clock and data for driving longer cable (up to 18 meters or 1400 pF reliably without violating the bus rise time). The 5 V tolerant CEC channel is internally connected to VCC(B) and has no rise time accelerator. The CEC channel can be used as an interrupt or reset. While retaining all the operating modes and features of the I2C-bus system during the level shift, it also permits extension of the I2C-bus by providing bidirectional buffering for data (SDA), clock (SCL), and CEC. Using the PCA9527 enables the system designer to isolate bus capacitance to meet HDMI DDC version 1.3 distance specification. The SDAx and SCLx pins are overvoltage tolerant and are high-impedance when the PCA9527 is unpowered. The port B drivers (SDAB, SCLB, CECB) with static level offset behave much like the drivers on the PCA9515 device, while the SDAA and SCLA drivers integrate the rise time accelerator, sink more current and eliminate the static offset voltage. The CECA driver has the same current and static offset voltage features as the SDAA and SCLA, but it does not have the rise time accelerator and is powered and referenced to VCC(B). This results in a LOW on the port B translating into a nearly 0 V LOW on port A, providing zero offset. The static level offset design of the port B I/O drivers prevent them from being connected to another device that has rise time accelerator including the PCA9507 (port B), PCA9510, PCA9511, PCA9512, PCA9513, PCA9514, PCA9515, PCA9516A, PCA9517 (port B), or PCA9518A. Port A of two or more PCA9527s can be connected together, however, to allow a star topography with port A on the common bus, and port A can be connected directly to any other buffer with static or dynamic offset voltage. Multiple PCA9527s can be connected in series, port A to port B, with no build-up in offset voltage with only time of flight delays to consider. Rise time accelerators on the SDAA and SCLA pins are turned on when input threshold is above 0.3VCC(A). The PCA9527 SDA and SCL drivers are not enabled unless VCC(A) and VCC(B) are above 2.7 V. The EN pin can also be used to turn the drivers on and off under system control. Caution should be observed to only change the state of the enable pin when the bus is idle. The output pull-down on the port B internal buffer LOW is set for approximately 0.5 V, while the input threshold of the internal buffer is set about 70 mV lower (0.43 V). When the port B I/O is driven LOW internally, the LOW is not recognized as a LOW by the input. This prevents a lock-up condition from occurring.
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
2. Features
I 3-channel, bidirectional buffer isolates capacitance allowing 1400 pF on port A and 400 pF on port B I Exceeds 18 meters (above the maximum distance for HDMI DDC) I Rise time accelerator and normal I/O on port A (no accelerator for CEC) I Static level offset on port B I Voltage level translation from 2.7 V to 5.5 V I CEC is 5 V tolerant, powered by VCC(B) I Upgrade replacement over PCA9507 and PCA9517A for cable application I I2C-bus, SMBus and DDC-bus compatible I Active HIGH buffer enable input I Open-drain input/outputs I Lock-up free operation I Supports arbitration and clock stretching across the repeater I Accommodates Standard-mode and Fast-mode I2C-bus devices and multiple masters I Powered-off high-impedance I2C-bus pins I Port A operating supply voltage range of 2.7 V to 5.5 V I Port B operating supply voltage range of 2.7 V to 3.6 V I 5 V tolerant I2C-bus and enable pins I 0 Hz to 400 kHz clock frequency (the maximum system operating frequency may be less than 400 kHz because of the delays added by the repeater) I ESD protection exceeds 8000 V HBM per JESD22-A114, 500 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA I Package offered: TSSOP10
3. Ordering information
Table 1. Ordering information Topside mark 9527 Package Name TSSOP10[1] Description plastic thin shrink small outline package; 10 leads; body width 3 mm Version SOT552-1 Type number PCA9527DP
[1]
Also known as MSOP10.
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
2 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
4. Functional diagram
VCC(A) VCC(A) DYNAMIC PULL-UP SCLA VCC(A) DYNAMIC PULL-UP SDAA SDAB SCLB VCC(B)
CECA VCC(B)
CECB
PCA9527
GND
100 k
EN
002aad970
Fig 1.
Functional diagram of PCA9527
5. Pinning information
5.1 Pinning
VCC(A) SCLA SDAA CECA GND
1 2 3 4 5
002aad969
10 VCC(B) 9 SCLB SDAB CECB EN
PCA9527DP
8 7 6
Fig 2.
Pin configuration for TSSOP10
5.2 Pin description
Table 2. Symbol VCC(A) SCLA SDAA CECA
PCA9527_1
Pin description Pin 1 2 3 4 Description port A supply voltage (2.7 V to 5.5 V) serial clock port A bus with rise time accelerator for DDC line or cable, 5 V tolerant serial data port A bus with rise time accelerator for DDC line or cable, 5 V tolerant serial data with normal I/O powered by VCC(B), 5 V tolerant
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
3 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
Pin description ...continued Pin 5 6 7 8 9 10 Description supply ground (0 V) active HIGH buffer enable input serial data with static level offset, powered by VCC(B), 5 V tolerant serial data port B bus with static level offset, 5 V tolerant serial clock port B bus with static level offset, 5 V tolerant port B supply voltage (2.7 V to 3.6 V)
Table 2. Symbol GND EN CECB SDAB SCLB VCC(B)
6. Functional description
Refer to Figure 1 "Functional diagram of PCA9527". The PCA9527 consists of 3 channels of bidirectional open-drain I/Os specifically designed to support up-translation/down-translation between low voltages (as low as 2.7 V) and a 3.3 V or 5 V I2C-bus and SMBus. The device contains a rise time accelerator, specifically on port A of the SCLA and SDAA that enables the device to drive a long cable or a heavier capacitive load for DDC, I2C-bus and SMBus applications. With dual supply rails, the device translates from voltage ranges 2.7 V to 5.5 V down to a voltage as low as 2.7 V without degradation of system performance. Unlike the SDAA and SCLA, the CECA is powered by the VCC(B) and does not have a rise time accelerator, but is similar in that its port A has normal I/O and port B static level offset. All I/Os are overvoltage tolerant to 5.5 V even when the device is un-powered (VCC(B) and/or VCC(A) = 0 V). The PCA9527 includes a power-up circuit that keeps the SDA and SCL output drivers turned off until VCC(A) and VCC(B) rise above 2.7 V. The CECA output drivers are turned OFF until VCC(B) rises above 2.7 V. VCC(A) and VCC(B) can be applied in any sequence at power-up.
VCC(B) port B 0.3VCC(B) 0.4 V 0.5 V 0V VCC(A) port A 0.3VCC(A) 0V
002aad435
0.7VCC(A)
Fig 3.
Port A and port B I/O levels
When port B falls first and goes below 0.3VCC(B) the port A driver is turned on and port A pulls down to 0 V. As port A falls below 0.3VCC(A) the port B pulls down to about 0.5 V. The external port B driver must drive the port B to a LOW that is 0.4 V or else it is not possible to know who is driving the port A LOW. The PCA9527 direction control assumes that port A is controlling the part unless port B falls below 0.4 V. When the port B voltage is 0.4 V the port A driver of the PCA9527 is on and holds port A down to nearly 0 V. As the port B voltage rises because the external driver turns off, the port B voltage rises up to ~0.5 V because port A is LOW; once port B rises to ~0.5 V the port A pull-down driver turns off. Then port A rises with a rise time determined by the RC of port A when it
PCA9527_1 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
crosses the port A threshold ~0.3VCC(A) the port B driver is turned off and the rising edge accelerator is turned on, which causes a faster rising edge until it reaches the turn-off point for the rising edge accelerator ~0.7VCC(A). Then it continues to rise at the slower rate determined by the RC of port A. When the port B driver turns off, port B rises with the RC of port B. VCC(A) powers the 0.3VCC(A) reference for SCLA and SDAA as well as the port A power good detect circuit. VCC(B) powers the rest of the chip including the port B I/Os, the CEC I/Os, and the support functions. Figure 3 illustrates the threshold and I/O levels for port A and port B.
6.1 Enable
The EN pin is active HIGH with an internal ~100 k pull-up to VCC(B) and allows the user to select when the buffer is active. The enable pin puts the PCA9527 in a power-down state when it is disabled, so that there is a recovery delay and a lower power-down power. This can be used to isolate the line when the HDMI DDC transmitter or receiver is not ready, or from a badly behaved slave on power-up until after the system power-up reset. It should never change state during an I2C-bus operation because disabling during a bus operation will hang the bus and enabling part way through a bus cycle could confuse the I2C-bus parts being enabled. The enable pin should only change state when the global bus and the buffer port are in an idle state to prevent system failures.
6.2 Rise time accelerators
PCA9527 has rise time accelerators on port A of SCL and SDA only; the CECA pin does not have a rise time accelerator. During port A positive bus transitions a current source is switched on to quickly slew the SDAA and SCLA lines HIGH once the input level of 0.3VCC(A) is exceeded for the PCA9527 and turns off as the 0.7VCC(A) voltage is approached.
6.3 Resistor pull-up value selection
6.3.1 Port A (SDAA and SCLA)
SDAA and SCLA are open-drain I/O that have rise time accelerators and strong pull-down. When the inputs transition above 0.3VCC(A), the rise time accelerator activates and boosts the pull-up current during rising edge to meet the I2C-bus rise time specification when the device drives a long cable or heavier capacitance load. The strong pull-down enables the output to drive to nearly zero voltage for logic LOW. The selection for pull-up resistors are defined in the HDMI DDC specification shown in Table 3. For HDMI transmitter applications like digital video player, recorder, or set-top box, the pull-up resistor is in the range of 1.5 k to 2 k. For HDMI receiver applications like in LCD TV or video card, the pull-up resistor is 47 k on the SCLA line, and there is no pull-up on the SDAA line. Please refer to Table 3, Figure 6 and Figure 7 for more details. Figure 4 shows the port A pull-up resistor values (in k) versus capacitance load (in nF) for 5 V supply voltage complied with 1 s rise time per I2C-bus Standard-mode specification. The graph contrasts a shaded and unshaded region. Any resistor value chosen within the unshaded region would comply with 1 s rise time, while any value chosen in the shaded region would not.
PCA9527_1
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Product data sheet
Rev. 01 -- 29 June 2009
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
HDMI DDC pull-up resistors specification Where at the source (DVD/STB) at the sink (LCD TV) at the source (DVD/STB) at the sink (LCD TV) Minimum 1.5 k 1.5 k Maximum 2.0 k 2.0 k 47 k 10 %
Table 3. Pin SDAA SCLA
10.5 RPU (k) 8.5
002aad620
6.5 does not comply with 1 s rise time 4.5 complies with 1 s rise time
2.5
0.5 0 1.0 2.0 3.0 CL (nF) 4.0
rise time = 1 s; VCC(A) = 5 V
Fig 4.
SDAA/SCLA line pull-up resistor versus load capacitance
6.3.2 Port A (CECA)
CECA does not have a rise time accelerator, but has a standard open-drain I/O. In addition to incurring no offset voltage, it has edge rate control and a lower capacitance than those of standard discrete MOSFET, and isolates the input/output capacitance. It is designed for a lower speed channel for consumer electronic control (less than 10 kHz) or general purpose interrupt or reset over long cable. CECA does not have internal pull-up. The pull-up resistor is calculated using standard I2C-bus pull-up resistor formula, as shown in Section 6.3.3 "Port B (SDAB, SCLB, CECB)".
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
6 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
6.3.3 Port B (SDAB, SCLB, CECB)
SDAB and SCLB are standard I2C-bus with static level offset that has no rise time accelerator. The static level offset produces an output LOW of 0.5 V (typical) at 6 mA. As with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH levels. The size of these pull-up resistors depends on the system requirement, and should meet the current sinking capability of the device that drives the buffer, as well as that of the buffer. The minimum and maximum pull-up resistors are determined and the pull-up resistor's value is chosen to be within the minimum and maximum range. Using Equation 1, calculate the minimum pull-up resistor value: V pu ( max ) - 0.4 V R PU ( min ) = ---------------------------------------I OL ( max ) Where: RPU(min) is the minimum pull-up resistor value for the open-drain SCLB and SDAB. Vpu(max) is the maximum supply rail of the pull-up resistor and should not exceed 5.5 V. 0.4 V is the maximum VOL of the device that drives the buffer on logic LOW. IOL(max) at VOL = 0.4 V is the maximum sink current of the device that drives the buffer on logic LOW. The maximum pull-up resistor should also be sized such that the RC time constant meets the standard I2C-bus rise time, which is 1 s for Standard-mode (100 kHz) or 300 ns for Fast-mode (400 kHz). DDC bus complies with the I2C-bus Standard-mode and operates below 100 kHz, and maximum rise time is 1 s using a simplified RC equation. Using Equation 2, calculate the maximum pull-up resistor value: R PU ( max ) x C L ( max ) = 1.2 x t r Where: RPU(max) is the maximum allowable pull-up resistor on the SCLB and SDAB in order to meet the I2C-bus rise time specification. CL(max) is the maximum allowable capacitance load (include the capacitance of driver, the line, and the buffer) in order to meet the rise time specification. tr is the rise time specified as 1 s (for bus speed 100 kHz or lower) and 300 ns (for bus speed 400 kHz or lower). The chosen pull-up resistor RPU is: RPU(min) RPU RPU(max). (2) (1)
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
7. Application design-in information
A typical application is shown in Figure 5. In this example, the system master is running on a 3.3 V I2C-bus while the slave is connected to a 5 V bus. Both buses run at 400 kHz. Master devices can be placed on either bus. HDMI DDC applications for DVD/R and LCD TV are shown in Figure 6 and Figure 7, respectively. In these applications the HDMI transmitter or receiver is 3.3 V, while the DDC line is 5 V, PCA9527 behaves like a voltage level shift, a buffer and long cable bus extender to ensure signal integrity for accessing the EDID on the DDC line.
3.3 V
5V
10 k
10 k
10 k
10 k
10 k
10 k
VCC(B) SDA SCL BUS MASTER 400 kHz INTR or RESET SDAB SCLB CECB
VCC(A) SDAA SCLA CECA INTR or RESET SLAVE 400 kHz SDA SCL
PCA9527
EN bus B bus A
002aad971
Fig 5.
Typical application
3.3 V
10 k (optional) 10 k 10 k 10 k 0.1 F 0.1 F 2.7 k 1.5 k to 2.0 k (2x)
5V
VCC(B) SDAB SCLB CECB EN
VCC(A) SDAA SCLA CECA
PCA9527
HDMI TRANSMITTER
22 22
HDMI cable DDC line
LCD TV (sink) PCA9507 PCA9512A PCA9515 PCA9517 PCA9527
GND DVD/R or STB
002aad972
Fig 6.
Source or DVD/R, STB application
PCA9527_1
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Product data sheet
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
3.3 V
10 k (optional) 10 k 10 k 10 k 0.1 F 0.1 F 10 k 47 k
5V
VCC(B) SDAB SCLB CECB EN
VCC(A) SDAA SCLA CECA
22 22
PCA9527
HDMI RECEIVER
HDMI cable DDC line
DVD (source) PCA9507 PCA9512A PCA9515 PCA9517 PCA9527
GND LCD TV
002aad973
Fig 7.
Sink or LCD TV application
According to Figure 5, when port A of the PCA9527 is pulled LOW by a driver on the I2C-bus, a comparator detects the falling edge when it goes below 0.3VCC(A) and causes the internal driver on port B to turn on, causing port B to pull down to about 0.5 V. When port B of the PCA9527 falls, first a CMOS hysteresis type input detects the falling edge and causes the internal driver on port A to turn on and pull the port A pin down to ground. In order to illustrate what would be seen in a typical application, refer to Figure 11 and Figure 12. If the bus master in Figure 5 were to write to the slave through the PCA9527, waveforms shown in Figure 11 would be observed on the A bus. This looks like a normal I2C-bus transmission except that the HIGH level may be as low as 2.7 V, and the turn on and turn off of the acknowledge signals are slightly delayed. The master drives the B bus to ground or lets it float to VCC(B) as it sends data to the slave at the falling edge of the 8th clock, master releases SDAB on the B bus and slave pulls SDAA on the A bus to ground, causing the PCA9527 to pull SDAB on the B bus to 0.5 V. At the falling edge of the 9th clock, the master again drives the B bus and slave releases the A bus. Multiple PCA9527 port A sides can be connected in a star configuration (Figure 8), allowing all nodes to communicate with each other. Multiple PCA9527s can be connected in series (Figure 9) as long as port A is connected to port B. I2C-bus slave devices can be connected to any of the bus segments. The number of devices that can be connected in series is limited by repeater delay/time-of-flight considerations on the maximum bus speed requirements.
PCA9527_1
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Product data sheet
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
VCC(A)
10 k 10 k
VCC(B)
10 k
10 k
10 k
10 k
VCC(A) SDAA SCLA CECA
VCC(B) SDAB SCLB CECB SDA SCL INT or RESET SLAVE 400 kHz
SDA SCL BUS MASTER INT or RESET
PCA9527
EN
10 k
10 k
10 k
VCC(A) SDAA SCLA CECA
VCC(B) SDAB SCLB CECB SDA SCL INT or RESET SLAVE 400 kHz
PCA9527
EN
10 k
10 k
10 k
VCC(A) SDAA SCLA CECA
VCC(B) SDAB SCLB CECB SDA SCL INT or RESET SLAVE 400 kHz
PCA9527
EN
002aad974
Fig 8.
Typical star application
VCC
10 k 10 k
10 k
10 k 10 k
10 k
10 k 10 k
10 k
10 k 10 k
10 k
SDA SCL BUS MASTER INT or RESET
SDAA SCLA CECA
SDAB SCLB CECB
PCA9527
EN
INT or RESET
SDAA SCLA CECA
SDAB SCLB CECB
PCA9527
EN
INT or RESET
SDAA SCLA CECA
SDAB SCLB CECB
SDA SCL INT or RESET
PCA9527
EN
SLAVE 400 kHz
002aad975
Fig 9.
Typical series application
PCA9527_1
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Product data sheet
Rev. 01 -- 29 June 2009
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NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
CARD 1 VCC(A)
RPU RPU
VCCB
10 k 10 k
CARD 2
10 k (optional)
VCC(A)
75 75 75
VCC(B) SDAB SCLB CECB MASTER OR SLAVE
SDAA SCLA CECA GND
INT or RESET
EN
002aad976
Fig 10. Typical application of PCA9527 driving a short cable
9th clock pulse acknowledge SCLA
SDAA
002aad431
Fig 11. Bus A (2.7 V to 5.5 V bus) waveform
9th clock pulse acknowledge SCLB
SDAB VOL of PCA9527
002aad977
VOL of slave
Fig 12. Bus B (2.7 V to 5.5 V) waveform
PCA9527_1
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Product data sheet
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PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC(B) VCC(A) VI/O II/O ISS Ptot Tstg Tamb Tj Parameter supply voltage port B supply voltage port A voltage on an input/output pin input/output current ground supply current total power dissipation storage temperature ambient temperature junction temperature operating in free air port B; port A; EN port A; port B Conditions Min -0.5 -0.5 -0.5 -55 -40 Max +7 +7 +7 50 100 100 +125 +85 +125 Unit V V V mA mA mW C C C
9. Static characteristics
Table 5. Static characteristics VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Supplies VCC(B) VCC(A) Istb ICCH(A) ICCL(A) supply voltage port B supply voltage port A standby current port A HIGH-level supply current port A LOW-level supply current A port channels LOW; VCC(B) = 3.6 V; VCC(A) = 5.5 V; B port open standby current inputs VCC or GND on pin VCC(B); EN = 0 V inputs VCC or GND on pin VCC(A); EN = 0 V
[1]
Parameter
Conditions
Min 2.7 2.7 -
Typ 40 0.5 1.1
Max 3.6 5.5 60 0.8 1.7
Unit V V A mA mA
Istb ICCH(B)
-
40
60
A
port B HIGH-level supply current all inputs HIGH; VCC(B) = 3.6 V; SDAA = SCLA = VCC(A); SDAB, SCLB, CECn, EN = VCC(B) VCC(A) = 5 V VCC(A) = 0 V 0.8 0.5 1.2 0.7 mA mA
ICCL(B)
port B LOW-level supply current B port channels LOW; VCC(B) = 3.6 V; A port open VCC(A) = 5 V VCC(A) = 0 V 1.4 0.7 1.4 2.2 1.1 2.2 mA mA mA
ICC(B)c
contention port B supply current VCC(B) = 3.6 V; SDAB = SCLB = 0.2 V
PCA9527_1
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Product data sheet
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PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
Table 5. Static characteristics ...continued VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol VIH VIL VILc VIK ILI IIL VOL VOL-VILc Parameter HIGH-level input voltage LOW-level input voltage contention LOW-level input voltage input clamping voltage input leakage current LOW-level input current LOW-level output voltage difference between LOW-level output and LOW-level input voltage contention input/output capacitance II = -18 mA VI = 5.5 V VI = 0.2 V IOL = 100 A or 6 mA guaranteed by design
[2]
Conditions
Min
Typ
Max 5.5 -1.2 1 10 0.6 70
Unit V V V A A V mV
Input and output SDAB, SCLB and CECB 0.7VCC(B) -0.5 -0.5 0.47 0.4 0.52 +0.3VCC(B) V
Cio
VI = 3 V or 0 V; VCC = 3.3 V VI = 3 V or 0 V; VCC = 0 V
-
6 6
8 8 5.5 -1.2 1 10 0.2 8 8 -
pF pF V V A A V pF pF mA
Input and output SDAA, SCLA VIH VIL VIK ILI IIL VOL Cio Itrt(pu) HIGH-level input voltage LOW-level input voltage input clamping voltage input leakage current LOW-level input current LOW-level output voltage input/output capacitance II = -18 mA VCC = VI = 5.5 V VI = 0.2 V IOL = 6 mA VI = 3 V or 0 V; VCC = 3.3 V VI = 3 V or 0 V; VCC = 0 V transient boosted pull-up current SCLA, SDAA only; VCC(A) = 4.5 V; slew rate = 1.25 V/s HIGH-level input voltage LOW-level input voltage input clamping voltage input leakage current LOW-level input current LOW-level output voltage input/output capacitance II = -18 mA VCC = VI = 5.5 V VI = 0.2 V IOL = 6 mA VI = 3 V or 0 V; VCC = 3.3 V VI = 3 V or 0 V; VCC = 0 V Enable VIL VIH IIL(EN) ILI Ci
PCA9527_1
0.7VCC(A) [3]
-0.5 -
0.1 6 6 6
+0.3VCC(A) V
Input and output CECA VIH VIL VIK ILI IIL VOL Cio 0.7VCC(B) [3]
5.5 -1.2 1 10 0.2 8 8
V V A A V pF pF
-0.5 -0.5
0.1 6 6 -10 2
+0.3VCC(B) V
LOW-level input voltage HIGH-level input voltage LOW-level input current on pin EN input leakage current input capacitance VI = 0.2 V, EN pin only; VCC = 3.6 V VI = VCC VI = 3.0 V or 0 V
+0.3VCC(B) V 5.5 -30 +1 5 V A A pF
0.7VCC(B) -1 -
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Product data sheet
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PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
[1] [2] [3]
LOW-level supply voltage. VIL specification is for the first LOW level seen by the SDAB/SCLB/CECB lines. VILc is for the second and subsequent LOW levels seen by the SDAB/SCLB/CECB lines to retain a valid LOW level the static level must be less than VILc. VIL for port A with envelope noise must be below 0.3VCC(A) for stable performance.
10. Dynamic characteristics
Table 6. Dynamic characteristics VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = -40 C to +85 C; unless otherwise specified.[1][2] Symbol tPLH tPHL tTLH tTHL tPLH tPHL tTLH tTHL tPLH tPHL tTLH tTHL tsu th trec(pd-act) Parameter LOW to HIGH propagation delay HIGH to LOW propagation delay Conditions port B to port A; Figure 15 port B to port A; Figure 13
[4]
Min 70 40 20 20
[5] [5]
Typ[3] 115 75 155 60 175 220 130 45 110 80 150 60 -
Max 350 180 280 100 310 330 260 100 250 180 260 100 -
Unit ns ns ns ns ns ns ns ns ns ns ns ns s ns s
LOW to HIGH output transition time port A; Figure 13 HIGH to LOW output transition time port A; Figure 13 LOW to HIGH propagation delay HIGH to LOW propagation delay port A to port B; Figure 14 port A to port B; Figure 14
125 130 80 20 40 40 80 20
LOW to HIGH output transition time port B; Figure 14 HIGH to LOW output transition time port B; Figure 14 LOW to HIGH propagation delay HIGH to LOW propagation delay CECA; Figure 16 CECA; Figure 16
LOW to HIGH output transition time CECA; Figure 16 HIGH to LOW output transition time CECA; Figure 16 set-up time hold time recovery time from power-down to active EN HIGH before START condition EN HIGH after STOP condition VCC(A) power-down to active; EN HIGH and VCC(B) on; VCC(A) ramping up VCC(B) power-down to active; EN HIGH and VCC(A) on; VCC(B) ramping up
[6] [6] [7]
200 200 200
[8]
200
-
-
s
[1]
Times are specified with loads of 1.35 k pull-up resistance and 57 pF load capacitance on port B, and 450 pull-up resistance and 57 pF load capacitance on port A. Different load resistance and capacitance will alter the RC time constant, thereby changing the propagation delay and transition times. Pull-up voltages are VCC(A) on port A and VCC(B) on port B. Typical values were measured with VCC(A) = 3.3 V at Tamb = 25 C, unless otherwise noted. The tPLH delay data from port B to port A is measured at 0.5 V on port B to 0.3VCC(A) on port A. The proportional delay data from port A to port B is measured at 0.3VCC(A) on port A to 0.3VCC(B) on port B. The enable pin, EN, should only change state when the global bus and the repeater port are in an idle state. If the VCC(A) ramp up is fast, then the trec(pd-act) time must be allowed before the inputs are switched. If the supply ramp up is slow, the channels may be connected even before the final supply voltage is reached. If the VCC(B) ramp up is fast, then the trec(pd-act) time must be allowed before the inputs are switched. If the supply ramp up is slow, the channels may be connected even before the final supply voltage is reached.
[2] [3] [4] [5] [6] [7] [8]
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
14 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
10.1 AC waveforms
VCC(B) input 0.3VCC(B) tPHL 80 % output 80 % 20 % tTLH 0.1 V VCC(A) output VOL
002aae449
VCC(A) input 0.3VCC(A) tPHL 80 % 0.3VCC(A) tPLH 80 % tTLH
002aad433
VCC(B)
0.3VCC(A) 20 % tTHL
0.3VCC(B) 0.3VCC(B) 20 % 20 % tTHL
Fig 13. tPHL propagation delay and transition times; SCLB/SDAB to SCLA/SDAA
Fig 14. Propagation delay and transition times; SCLA/SDAA to SCLB/SDAB
VCC(B) input SDAB, SCLB, CECB input 0.5 V 0.3VCC(B) tPHL 80 % output 0.3VCC(A)(1) tPLH
002aae460
0.3VCC(B) tPLH 80 % tTLH
002aae450
VCC(B)
output SCLA, SDAA, CECA
0.3VCC(B) 0.3VCC(B) 20 % 20 % tTHL
(1) CECA output has 0.3VCC(B) reference.
Fig 15. tPLH propagation delay; B inputs to A inputs
Fig 16. Propagation delay and transition times; CEC in to CEC out
11. Test information
VCC(B) VCC(A) PULSE GENERATOR VI DUT
RT CL
VCC(B)
RL
VO
002aab649
RL = load resistor; 1.35 k on port B (2.7 V to 5 V) and 1.5 k on port A (5.0 V). CL = load capacitance includes jig and probe capacitance; 57 pF. RT = termination resistance should be equal to Zo of pulse generators.
Fig 17. Test circuit for open-drain outputs
PCA9527_1
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Product data sheet
Rev. 01 -- 29 June 2009
15 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
12. Package outline
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm SOT552-1
D
E
A
X
c y HE vMA
Z
10
6
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
5
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.15 c 0.23 0.15 D (1) 3.1 2.9 E (2) 3.1 2.9 e 0.5 HE 5.0 4.8 L 0.95 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z (1) 0.67 0.34 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT552-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-07-29 03-02-18
Fig 18. Package outline SOT552-1 (TSSOP10)
PCA9527_1 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
16 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
PCA9527_1 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
17 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
13.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8
Table 7. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 8. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 19.
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
18 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 19. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
14. Abbreviations
Table 9. Acronym CDM CEC CMOS DDC DVD DUT EDID ESD HBM HDMI I2C-bus I/O LCD MM MOSFET RC SMBus STB Abbreviations Description Charged-Device Model Consumer Electronic Control Complementary Metal-Oxide Semiconductor Display Data Channel Digital Video Disc Device Under Test Extended Display Identification Data ElectroStatic Discharge Human Body Model High-Definition Multimedia Interface Inter Integrated Circuit bus Input/Output Liquid Crystal Display Machine Model Metal-Oxide Semiconductor Field-Effect Transistor Resistor-Capacitor network System Management Bus Set-Top Box
PCA9527_1
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Product data sheet
Rev. 01 -- 29 June 2009
19 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
15. Revision history
Table 10. Revision history Release date 20090629 Data sheet status Product data sheet Change notice Supersedes Document ID PCA9527_1
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
20 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.
16.4 Licenses
Purchase of NXP ICs with HDMI technology Use of an NXP IC with HDMI technology in equipment that complies with the HDMI standard requires a license from HDMI Licensing LLC, 1060 E. Arques Avenue Suite 100, Sunnyvale CA 94085, USA, e-mail: admin@hdmi.org.
16.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9527_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 29 June 2009
21 of 22
NXP Semiconductors
PCA9527
3-channel bidirectional bus extender for HDMI, I2C-bus and SMBus
18. Contents
1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.3 6.3.1 6.3.2 6.3.3 7 8 9 10 10.1 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 16.3 16.4 16.5 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Rise time accelerators . . . . . . . . . . . . . . . . . . . 5 Resistor pull-up value selection . . . . . . . . . . . . 5 Port A (SDAA and SCLA) . . . . . . . . . . . . . . . . . 5 Port A (CECA) . . . . . . . . . . . . . . . . . . . . . . . . . 6 Port B (SDAB, SCLB, CECB) . . . . . . . . . . . . . . 7 Application design-in information . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 Static characteristics. . . . . . . . . . . . . . . . . . . . 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering of SMD packages . . . . . . . . . . . . . . 17 Introduction to soldering . . . . . . . . . . . . . . . . . 17 Wave and reflow soldering . . . . . . . . . . . . . . . 17 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 June 2009 Document identifier: PCA9527_1

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